论文标题
部分可观测时空混沌系统的无模型预测
A Survey of fault models and fault tolerance methods for 2D bus-based multi-core systems and TSV based 3D NOC many-core systems
论文作者
论文摘要
储层计算是预测湍流的有力工具，其简单的架构具有处理大型系统的计算效率。然而，其实现通常需要完整的状态向量测量和系统非线性知识。我们使用非线性投影函数将系统测量扩展到高维空间，然后将其输入到储层中以获得预测。我们展示了这种储层计算网络在时空混沌系统上的应用，该系统模拟了湍流的若干特征。我们表明，使用径向基函数作为非线性投影器，即使只有部分观测并且不知道控制方程，也能稳健地捕捉复杂的系统非线性。最后，我们表明，当测量稀疏、不完整且带有噪声，甚至控制方程变得不准确时，我们的网络仍然可以产生相当准确的预测，从而为实际湍流系统的无模型预测铺平了道路。
Reliability has taken centre stage in the development of high-performance computing processors. A Surge of interest is noticeable in recent times in formulating fault and failure models, understanding failure mechanism and strategizing fault mitigation methods for improving the reliability of the system. The article presents a congregation of concepts illustrated one after the other for a better understanding of damages caused by radiation, relevant fault models, and effects of faults. We examine the state of art fault mitigation techniques at the logical layer for digital CMOS based design and SRAM based FPGA. CMOS SRAM structure is the same for both digital CMOS and FPGA. Understanding of resilient SRAM based FPGA is necessary for developing resilient prototypes and it facilitates a faster integration of digital CMOS designs. At the micro-architectural and architectural layer, error detection and recovery methods are discussed for bus-based multi-core systems. The Through silicon via based 3D Network on chip is the prospective solution for integrating many cores on single die. A suitable interconnection approach for petascale computing on many-core systems. The article presents an elaborate discussion on fault models, failure mechanisms, resilient 3D routers, defect tolerance methods for the TSV based 3D NOC many-core systems. Core redundancy, self-diagnosis and distributed diagnosis at the hardware level are examined for many-core systems. The article presents a gamut of fault tolerance solutions from logic level to processor core level in a multi-core and many-core scenario.
