论文标题

节能计算系统:技术和标准的体系结构,抽象和建模

Energy Efficient Computing Systems: Architectures, Abstractions and Modeling to Techniques and Standards

论文作者

Muralidhar, Rajeev, Borovica-Gajic, Renata, Buyya, Rajkumar

论文摘要

计算系统已经经历了多个体流点 - 而摩尔的法律指导半导体行业将越来越多的晶体管和逻辑塞入相同的体积中,指导级并行性的极限(ILP),而丹纳德的终结将行业的缩放驱动到了多核芯片。现在,我们进入了针对AI和ML等新工作负载的特定领域架构时代。可以说,这些趋势与其他局限性,以及更严格的整合,极端形态和多样化的工作负载所面临的挑战,从能效的角度来看,系统更加复杂。许多研究调查涵盖了跨设备,服务器,HPC,数据中心系统以及软件,算法,能源效率和热管理框架的硬件,服务器,数据中心系统的技术和微观结构中的不同方面。在某种程度上,半导体行业已经开发了有关复杂芯片规范,建模和验证的技术和标准。以前的研究调查尚未详细解决这些领域。 This survey aims to bring these domains together and is composed of a systematic categorization of key aspects of building energy efficient systems - (a) specification - the ability to precisely specify the power intent or properties at different layers (b) modeling and simulation of the entire system or subsystem (hardware or software or both) so as to be able to perform what-if analysis, (c) techniques used for implementing energy efficiency at different levels of the stack, (d)验证技术用于保证保留复杂设计的功能,(e)旨在标准化能源效率不同方面的能源效率标准和财团,包括跨层优化。

Computing systems have undergone several inflexion points - while Moore's law guided the semiconductor industry to cram more and more transistors and logic into the same volume, the limits of instruction-level parallelism (ILP) and the end of Dennard's scaling drove the industry towards multi-core chips. We have now entered the era of domain-specific architectures for new workloads like AI and ML. These trends continue, arguably with other limits, along with challenges imposed by tighter integration, extreme form factors and diverse workloads, making systems more complex from an energy efficiency perspective. Many research surveys have covered different aspects of techniques in hardware and microarchitecture across devices, servers, HPC, data center systems along with software, algorithms, frameworks for energy efficiency and thermal management. Somewhat in parallel, the semiconductor industry has developed techniques and standards around specification, modeling and verification of complex chips; these areas have not been addressed in detail by previous research surveys. This survey aims to bring these domains together and is composed of a systematic categorization of key aspects of building energy efficient systems - (a) specification - the ability to precisely specify the power intent or properties at different layers (b) modeling and simulation of the entire system or subsystem (hardware or software or both) so as to be able to perform what-if analysis, (c) techniques used for implementing energy efficiency at different levels of the stack, (d) verification techniques used to provide guarantees that the functionality of complex designs are preserved, and (e) energy efficiency standards and consortiums that aim to standardize different aspects of energy efficiency, including cross-layer optimizations.

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