论文标题

金属在聚苯胺上的宽大电义沉积

Underpotential electroless deposition of metals on polyaniline

论文作者

Singh, Amrita, Contractora, Asfiya, Kale, Ravindra D., Juvekar, Vinay A

论文摘要

已经开发了一种在高度共轭聚苯胺膜上沉积金属的新技术。通常,由于氢在过程中演变的氢的破坏作用,金属的电沉积(从水溶液中具有低还原电位)很难。使用具有高表面质量密度的电导聚合物膜可以避免这种困难。这些薄膜的聚合物链具有高度的共轭。这种聚合物会产生高度稳定的极性,因此具有执行无电位沉积的能力。我们的方法涉及用甲酸还原聚苯胺膜,然后将涂层电极浸入金属盐溶液中。金属的沉积通过电极的开路电势的上升来监测。已经实现了具有高表面质量密度的金属的沉积。该金属很可能存在于聚合物中,作为与胺氮的配位配合物。这种形式的金属有望比零价金属具有更高的催化活性。我们已经能够存放Mn和Cu等金属。其中,MN不能通过任何其他方法沉积在聚合物上。

A novel technique to deposit metals on highly conjugated polyaniline films has been developed. In general, electrodeposition of metals, having low reduction potential, from aqueous solution, is difficult due to disruptive effect of hydrogen which evolves during the process. This difficulty is avoided using conducting polymers films with high surface mass density. The polymer chains of these films possess a high degree of conjugation. Such a polymer produces highly stable polarons and therefore has the ability to perform underpotential deposition. Our method involves reduction of polyaniline film with formic acid followed by dipping the coated electrode in the metal salt solution. Deposition of the metal is monitored by rise in the open circuit potential of the electrode. Deposition of metals with high surface mass density has been achieved. The metal is most likely present in the polymer as a coordination complex with amine nitrogen. Such form of metal is expected to have higher catalytic activity than the zero-valent metal. We have been able to deposit metals such as Mn and Cu. Among these, Mn cannot be deposited on polymer by any other method.

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